Toru Mochida is a prominent inventor based in Higashiyamato, Japan. He has made significant contributions to the field of wire bonding technology, holding a total of 6 patents. His work has advanced the methods and apparatus used in semiconductor manufacturing, showcasing his expertise and innovative spirit.

Latest Patents

Mochida's latest patents include a wire bonding method, a wire bonding apparatus, and a wire bonding program. The wire bonding method involves a detailed process where, following the formation of a neck portion on a wire at a first bonding point, the capillary is raised while paying out a specified length of wire. This process continues with the capillary moving toward a second bonding point to form a kink on the wire, followed by lowering the capillary to take in more wire. Ultimately, the capillary is moved back to complete a wire loop between the bonding points. His wire bonding apparatus is designed to ensure consistent heights and shapes of bonded wire loops, regardless of the bonding position on the semiconductor chip.

Career Highlights

Mochida is associated with Kabushiki Kaisha Shinkawa, where he has been instrumental in developing advanced wire bonding techniques. His innovative approaches have not only improved efficiency but also enhanced the reliability of semiconductor devices.

Collaborations

Throughout his career, Mochida has collaborated with notable colleagues, including Yoshimitsu Terakado and Masayuki Seguro. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Toru Mochida's contributions to wire bonding technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to influence the semiconductor industry, making him a key figure in modern engineering.

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