The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2000
Filed:
Dec. 28, 1998
Applicant:
Inventors:
Toru Mochida, Higashiyamato, JP;
Shinichi Nishiura, Fussa, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
228102 ; 228-45 ; 228106 ; 2281805 ;
Abstract
So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.