Kabushiki Kaisha Shinkawa

Toru Mochida

Yoshimitsu Terakado

Masayuki Seguro

Shinichi Nishiura

Shigeru Shiozawa

Wire bonding being performed by, following the formation of a neck portion on a wire at a first bonding point, raising the capillary from the neck portion while paying out a first specified length of wire, causing the capillary to move toward a second bonding point so that a first kink is formed on the wire, then lowering the capillary so that a second specified length of wire is taken into the capillary, and moving the capillary in the opposite direction from the second bonding point so as to form a second kink, and then raising the capillary, while paying out the wire, until the first kink is positioned at the lower end of the capillary, and finally, with the wire being is held in this state, moving the capillary to the second bonding point, thus completing a wire loop between the first and second bonding points.

Wire bonding method, wire bonding apparatus and wire bonding program

So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Wire bonding method and apparatus

A method for setting data for conveying a lead frame having a plurality of islands thereon to and from a bonding position of a bonding apparatus including feeding a lead frame so that the first island on the lead frame is positioned at the bonding position and the cross-hairs of a television monitor are aligned with an arbitrary position on the first island, storing the amount of feeding of the lead frame in a data memory, feeding the lead frame next so that the last island on the lead frame is positioned at the bonding position, aligning an arbitrary position on the last island which corresponds to the arbitrary position on the first island with the cross-hairs of the television camera and storing the amount of feeding of the lead frame in the data memory.

Method for setting conveying data for a lead frame

In a lead frame conveying method and apparatus used in, for instance, a wire bonding machine, a detection of the leading end of a lead frame supplied from a lead frame magazine and a positioning of the lead frame on a lead frame path are executed by a positioning sensor which is installed in the vicinity of a bonding position; and after the positioning, the lead frame is chucked by feeding claws so that a first bonding portion on the lead frame is conveyed by the feeding claws to the bonding position, thus avoiding use of the end surfaces of the feeding claws during the execution of positioning of the lead frame.

Lead frame conveying method and conveying apparatus

A data, which is used for raising-and-lowering a magazine holder on which a magazine for storing articles such as lead frames is placed in a magazine elevator device, being set by the steps of: placing a magazine on the magazine holder, storing in a memory the number of article storing sections of this magazine, aligning the lowermost article storing section of the magazine with the level of a lead frame conveying path by moving the magazine holder, storing in the memory the positional data of the thus moved magazine holder, aligning the uppermost article storing section of the magazine with the level of the frame conveying path by further moving the magazine holder, and then storing in the memory the data of the thus further moved magazine holder.

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Higashiyamato, Japan

Toru Mochida