Toru Maeda

Title: Toru Maeda: Innovator in Composite Materials and Semiconductor Packaging

Introduction

Toru Maeda is a prominent inventor based in Osaka, Japan. He has made significant contributions to the fields of composite materials and semiconductor packaging. With a total of 3 patents, his work reflects a deep understanding of material science and engineering.

Latest Patents

Maeda's latest patents include innovative designs for composite materials and semiconductor packages. One of his notable inventions is a composite material that features a plate shape with a first and second surface. This composite material consists of multiple first layers and at least one second layer, which are alternately layered along the thickness direction. Each first layer is composed of copper, while the second layer is a molybdenum powder compact that is impregnated with copper. This design ensures that a compressive residual stress of 50 MPa or less is maintained on the first layers located at both surfaces.

Another significant patent involves an aluminum alloy plate, terminal, electric wire with terminal, and bus bar. The aluminum alloy in the cross-section of the surface layer region contains a compound with elements such as silicon, magnesium, and copper. The patent specifies that the number of fields of view containing this compound should be limited to 3 or less out of 10 fields of view extracted from the cross-section.

Career Highlights

Throughout his career, Toru Maeda has worked with notable companies such as Sumitomo Electric Industries, Limited and Sumitomo Wiring Systems, Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in material technology.

Collaborations

Maeda has collaborated with talented individuals in his field, including Ryohei Kobayashi and Tetsuya Kuwabara. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Toru Maeda is a distinguished inventor whose work in composite materials and semiconductor packaging has made a significant impact in the industry. His innovative patents and collaborations highlight his expertise and dedication to advancing technology.