The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Jan. 31, 2022
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Autonetworks Technologies, Ltd., Mie, JP;

Inventors:

Ryohei Kobayashi, Osaka, JP;

Toru Maeda, Osaka, JP;

Tetsuya Kuwabara, Osaka, JP;

Masashi Fujiki, Yokkaichi, JP;

Akihiro Hayashi, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 21/08 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
C22C 21/08 (2013.01); H01R 13/03 (2013.01);
Abstract

The aluminum alloy in the cross-section of the surface layer region of the aluminum alloy plate contains a compound containing one or more elements selected from the group consisting of silicon, magnesium, iron, copper, manganese, chromium, zinc, zirconium, and titanium, and aluminum. The number of fields of view containing the compound having an equivalent circle diameter of 5 μm or more out of 10 fields of view extracted from the cross-section is 3 or less. In the cross-section, the number density of the compound having an equivalent circle diameter of 1.5 μm or more and less than 5.0 μm is 0.0010 per μmor less, and the area ratio of the compound having an equivalent circle diameter of 0.5 μm or more is 0.1% or more and less than 1.0%.


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