Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

A.l.m.t. Corporation

Toru Maeda

Tetsuya Kuwabara

Akihiro Hayashi

Masashi Fujiki

Daisuke Kondo

Kei Hirai

Masayuki Ito

Ryohei Kobayashi

A composite material has a plate shape and has a first surface and a second surface. The second surface is opposite to the first surface. The composite material includes a plurality of first layers and at least one second layer. The first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface. Each of the first layers is a layer including copper. The second layer is a layer of a molybdenum powder compact impregnated with copper. A compressive residual stress of 50 MPa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.

Composite material, semiconductor package, and method of manufacturing composite material

The aluminum alloy in the cross-section of the surface layer region of the aluminum alloy plate contains a compound containing one or more elements selected from the group consisting of silicon, magnesium, iron, copper, manganese, chromium, zinc, zirconium, and titanium, and aluminum. The number of fields of view containing the compound having an equivalent circle diameter of 5 μm or more out of 10 fields of view extracted from the cross-section is 3 or less. In the cross-section, the number density of the compound having an equivalent circle diameter of 1.5 μm or more and less than 5.0 μm is 0.0010 per μmor less, and the area ratio of the compound having an equivalent circle diameter of 0.5 μm or more is 0.1% or more and less than 1.0%.

Aluminum alloy plate, terminal, electric wire with terminal, and bus bar

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Osaka, Japan

Toru Maeda