Yokohama, Japan

Tooru Mita


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 65(Granted Patents)


Company Filing History:


Years Active: 1988-1991

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2 patents (USPTO):Explore Patents

Title: Tooru Mita: Innovator in Semiconductor Bonding Technologies

Introduction

Tooru Mita is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the area of bonding methods for integrated circuits. With a total of 2 patents to his name, Mita's work has advanced the efficiency and reliability of chip mounting processes.

Latest Patents

Mita's latest patents include a method of aligning and bonding tab inner leads and a die bonding apparatus. The first patent describes a multi-pin chip mounting method and apparatus utilizing a Tape Automated Bonding (TAB) system. This innovation allows for precise alignment and compression bonding of leads formed on a tape with bumps on an IC chip. The process involves detecting the position of the IC chip and adjusting the stage accordingly to ensure accurate bonding.

The second patent focuses on a die bonding apparatus designed to establish electrical connections between semiconductor chips and their packages. This apparatus features pinching and pressing mechanisms that ensure uniform pressure on the electrodes, even when the chip is inclined. This innovation addresses the challenge of varying bump sizes on the chip's electrodes, enhancing the reliability of the bonding process.

Career Highlights

Tooru Mita is associated with Hitachi, Ltd., a leading company in the technology sector. His work at Hitachi has allowed him to develop and refine his innovative bonding techniques, contributing to the company's reputation for excellence in semiconductor manufacturing.

Collaborations

Mita has collaborated with notable colleagues, including Michio Takahashi and Yasuo Nakagawa. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in semiconductor technology.

Conclusion

Tooru Mita's contributions to semiconductor bonding technologies have made a significant impact on the industry. His innovative patents and collaborative efforts continue to shape the future of integrated circuit manufacturing.

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