Hitachi, Ltd.

Tooru Mita

Michio Takahashi

Hiroyuki Tanaka

Aizo Kaneda

Shinichi Arai

Yasuo Nakagawa

Koichi Sugimoto

Toshimitsu Hamada

Hisafumi Iwata

Tsutomu Mimata

Toshihiko Sakai

Tatsuhiro Suzuki

Kouji Serizawa

Keizo Matsukawa

The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.

Method of aligning and bonding tab inner leads

As a die bonding apparatus for establishing electrical connection between electrodes on one side of a semiconductor chip and associated electrodes on a package comprises a pair of pinching and pressing mechanisms having a pair of pinching and pressing surfaces adapted to be moved closer relative to each other and so as to pinch and press semiconductor chip and package and at least one remote center mechanism provided in at least one of the pair of pinching and pressing mechanisms, in such a manner that a remote center thereof is positioned in the pinching and pressing surface of above-mentioned one pinching and pressing mechanism, for adjusting orientations of the pair of pinching and pressing surfaces to make the orientations thereof correspond to those of both surfaces of the semiconductor chip and the package at the time of the pressing and pinching operation all of the electrodes on one side of the semiconductor chip are thereby uniformly pressed against the corresponding electrodes on the package without any laterally shifting movement thereof even if the chip is inclined relative to the package because the sizes of bumps of the electrodes on the chip are not constant.

Die bonding apparatus

Growing community of inventors

Yokohama, Japan

Tooru Mita