This inventor holds 2 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2016-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016-2017
Title: Toong Erh Ooi: Innovator in Embedded Die Technology
Introduction
Toong Erh Ooi is a notable inventor based in Butterworth, Malaysia. He has made significant contributions to the field of embedded die technology, holding two patents that showcase his innovative approach to electronic packaging.
Latest Patents
Toong Erh Ooi's latest patents include an embedded die-down package-on-package device. This apparatus features a die and a build-up carrier that consists of alternating layers of conductive and dielectric materials. The design incorporates a gradation of carrier contact points that connect the carrier to a substrate. The method involves disposing a die on a sacrificial substrate, forming a build-up carrier adjacent to the die, and separating the die and carrier from the substrate.
Career Highlights
Toong Erh Ooi is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work focuses on enhancing the efficiency and performance of electronic devices through innovative packaging solutions.
Collaborations
Some of his coworkers include Bok Eng Cheah and Nitesh Nimkar, who contribute to the collaborative environment at Intel Corporation.
Conclusion
Toong Erh Ooi's contributions to embedded die technology reflect his commitment to innovation in the electronics industry. His patents demonstrate a forward-thinking approach that is essential for the advancement of modern technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile