The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9455218 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 27, 2016

Filed:

Mar. 28, 2013
Applicants:

Toong Erh Ooi, Butterworth, MY;

Bok Eng Cheah, Bayan Lepas, MY;

Nitesh Nimkar, Chandler, AZ (US);

Inventors:

Toong Erh Ooi, Butterworth, MY;

Bok Eng Cheah, Bayan Lepas, MY;

Nitesh Nimkar, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/50 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/82039 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18162 (2013.01); H05K 1/185 (2013.01); H05K 3/4682 (2013.01); H05K 2201/10674 (2013.01);
Abstract

An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die and configured for connecting the carrier to a substrate. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier includes a dielectric material defining a gradation between the device side of the die and a backside of the die, the gradation including a plurality of carrier contact points; and separating the die and the carrier from the sacrificial substrate.


Find Patent Forward Citations

Ooi, Toong. (2016). Embedded die-down package-on-package device (U.S. Patent No. 9455218). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9455218

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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