This inventor holds 7 USPTO granted patents and 2 EPO patents. Top assignees: Ricoh Company, Ltd., Other. Active years: 2004-2014.
Location History:
- Numazu, JP (2004 - 2010)
- Shizuoka, JP (2006 - 2014)
Company Filing History:
6 out of 28,915 
1 out of 834,350 Years Active: 2004-2014
Title: Innovations of Tomoyuki Kugo
Introduction
Tomoyuki Kugo is a notable inventor based in Numazu, Japan. He has made significant contributions to the field of adhesive materials, holding a total of 7 patents. His work focuses on developing heat-sensitive adhesive materials that enhance adhesive strength over time.
Latest Patents
Kugo's latest patents include a heat-sensitive adhesive material, adhered article, and a process and apparatus for thermally activating the heat-sensitive adhesive material. This innovative adhesive material consists of a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer. The unique configuration allows the adhesive strength to increase with time after application to an adherend. Another patent focuses on providing heat-sensitive adhesive materials that exhibit high pressure-sensitive adhesive strength with respect to rough adherends, such as cardboards or polyolefin wraps. These materials are designed to be thermally activated with lower energy and demonstrate excellent blocking resistance.
Career Highlights
Throughout his career, Kugo has worked with prominent companies, including Ricoh Company, Ltd. His experience in the industry has allowed him to refine his inventions and contribute to advancements in adhesive technology.
Collaborations
Kugo has collaborated with notable coworkers, including Hiroshi Goto and Toshiaki Ikeda. Their combined expertise has likely played a role in the successful development of Kugo's innovative adhesive materials.
Conclusion
Tomoyuki Kugo's contributions to adhesive technology through his patents and collaborations highlight his role as a significant inventor in this field. His innovative approaches continue to influence the development of heat-sensitive adhesive materials.