The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Aug. 28, 2002
Applicants:
Tomoyuki Kugo, Shizuoka, JP;
Toshiaki Ikeda, Shizuoka, JP;
Inventors:
Tomoyuki Kugo, Shizuoka, JP;
Toshiaki Ikeda, Shizuoka, JP;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/10 (2006.01); B32B 27/30 (2006.01); C08J 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E<Ewhere Eis heat energy to fuse the solid plasticizer; and Eis heat energy to fuse the heat-fusible substance.