The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2010
Filed:
Sep. 13, 2005
Hiroshi Goto, Atsugi, JP;
Tomoyuki Kugo, Numazu, JP;
Mitsunobu Morita, Numazu, JP;
Norihiko Inaba, Numazu, JP;
Tohru Kitano, Numazu, JP;
Takehito Yamaguchi, Numazu, JP;
Hiroshi Goto, Atsugi, JP;
Tomoyuki Kugo, Numazu, JP;
Mitsunobu Morita, Numazu, JP;
Norihiko Inaba, Numazu, JP;
Tohru Kitano, Numazu, JP;
Takehito Yamaguchi, Numazu, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.