Chiyoda-ku, Japan

Tomoya Hosoda

USPTO Granted Patents = 22 

 

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Chiyoda-ku, JP (2018 - 2023)
  • Tokyo, JP (2019 - 2024)

Company Filing History:


Years Active: 2018-2025

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22 patents (USPTO):Explore Patents

Title: Innovations by Tomoya Hosoda: A Leader in High-Performance Film Technologies

Introduction

Tomoya Hosoda, based in Chiyoda-ku, Japan, is a distinguished inventor known for his significant contributions in the field of high-performance film technologies. With an impressive portfolio of 21 patents, his work focuses on developing innovative materials that are both heat-resistant and adhesive. His latest patents showcase groundbreaking advancements that are poised to enhance numerous industrial applications.

Latest Patents

Among Hosoda's latest patents is a heat-resistant film that boasts high adhesion and low warping. This invention involves a method for producing the film along with a metal-clad laminate and a coated metal conductor. The unique film incorporates an aromatic polyimide base and features layers containing polymers that consist of tetrafluoroethylene and a perfluoro(alkyl vinyl ether), providing exceptional durability.

In addition, he has patented a long film made from thermomeltable polymers that feature a distinct configuration with spherulites measuring 10 micrometers or less. This film is engineered to maintain a minimal thermal expansion rate, making it suitable for various applications requiring precision and stability under heat.

Career Highlights

Tomoya Hosoda is currently employed at AGC Inc., where he has made remarkable strides in enhancing the performance characteristics of polyimide films and other related materials. His expertise has positioned him at the forefront of innovations in materials science, especially in the development of films that meet demanding industrial requirements.

Collaborations

Throughout his career, Hosoda has collaborated with esteemed colleagues including Wataru Kasai and Takashi Sato. This collaboration has been pivotal in fostering a creative environment that encourages the exchange of ideas and innovative solutions.

Conclusion

With an extensive patent portfolio and ongoing research, Tomoya Hosoda continues to push the boundaries of materials innovation. His contributions have not only improved the properties of heat-resistant films but also paved the way for future advancements in this crucial industry. Hosoda's dedication to innovation keeps him at the cutting edge of technology, solidifying his role as a leading inventor in the field.

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