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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11041053 B1

PDFFull Text
Date of Patent:
Jun. 22, 2021

Filed:

Dec. 10, 2019

Resin powder, method for its production, composite, molded product, method for producing ceramic molded product, metal laminated plate, printed circuit board and prepreg

Applicant:

Agc Inc., Tokyo, JP;

Inventors:

Tomoya Hosoda, Chiyoda-ku, JP;

Eiichi Nishi, Chiyoda-ku, JP;

Toru Sasaki, Chiyoda-ku, JP;

Nobutaka Kidera, Chiyoda-ku, JP;

Assignee:

AGC Inc., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

John E Uselding

Int. Cl.
CPC ...
C08J 3/12 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); C08J 5/10 (2006.01); B32B 27/38 (2006.01); B32B 15/20 (2006.01); B32B 15/18 (2006.01); B32B 9/00 (2006.01); C08L 79/08 (2006.01); B32B 9/04 (2006.01); C08L 101/00 (2006.01); B32B 27/32 (2006.01); B32B 27/18 (2006.01); B32B 27/08 (2006.01); C08L 63/00 (2006.01); H05K 1/03 (2006.01); B32B 5/16 (2006.01); B32B 7/12 (2006.01); C08J 5/24 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); C08F 214/26 (2006.01);
U.S. Cl.
CPC ...
C08J 3/12 (2013.01); B32B 5/16 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/30 (2013.01); B32B 27/322 (2013.01); B32B 27/38 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); C08L 101/00 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); H05K 3/0014 (2013.01); H05K 3/06 (2013.01); B32B 2250/44 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2307/50 (2013.01); B32B 2307/714 (2013.01); B32B 2457/08 (2013.01); B32B 2605/08 (2013.01); B32B 2605/18 (2013.01); C08F 214/26 (2013.01); C08F 214/262 (2013.01); C08J 2327/12 (2013.01); C08J 2327/18 (2013.01); C08J 2327/22 (2013.01); C08J 2427/18 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A resin powder having a high bulk density and an average particle size of at most 50 μm from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene. A method of producing the resin powder by subjecting resin particles (A) having an average particle size of at least 100 μm to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component, which has a unit (1) based on a monomer containing at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene.

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