The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Mar. 04, 2020
Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventors:

Wataru Kasai, Chiyoda-ku, JP;

Tomoya Hosoda, Chiyoda-ku, JP;

Assignee:

AGC Inc., Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 27/30 (2006.01); B32B 15/082 (2006.01); C08J 5/18 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
B32B 27/30 (2013.01); B32B 3/266 (2013.01); B32B 15/082 (2013.01); C08J 5/18 (2013.01); H05K 1/0353 (2013.01); H05K 3/0038 (2013.01); H05K 3/022 (2013.01); B32B 2457/08 (2013.01); C08J 2327/18 (2013.01); H05K 2201/015 (2013.01); H05K 2203/107 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24322 (2015.01);
Abstract

To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.


Find Patent Forward Citations

Loading…