Location History:
- Gunma, JP (2013 - 2014)
- Shibukawa, JP (2012 - 2016)
Company Filing History:
Years Active: 2012-2016
Title: The Innovative Mind of Tomomichi Takatsu
Introduction
Tomomichi Takatsu, based in Shibukawa, Japan, is a distinguished inventor with a remarkable portfolio of nine patents. His work primarily focuses on adhesive technologies that have significant applications in the electronics and semiconductor industries. Takatsu's contributions have not only advanced these fields but also showcased his exceptional creativity and technical prowess.
Latest Patents
Among Takatsu's latest inventions is an innovative adhesive sheet designed for enhanced performance. This adhesive sheet includes a substrate comprised of polyvinyl chloride combined with a polyester-based plasticizer. The adhesive composition features two distinct (meth)acrylate copolymer components, labeled (A) and (B), mixed in a precise mass ratio of 10:90 to 90:10. Notably, the mixture contains a cross-linking agent that ranges from 0.5 to 20 mass parts for every 100 mass parts of components A and B, ensuring a robust bond.
Another significant patent relates to an adhesive sheet and a method for backgrinding semiconductor wafers. This innovation addresses the challenges faced when peeling adhesive sheets from thinner semiconductor wafers, which often resulted in damage. The adhesive sheet, made from an ethylene/vinyl acetate copolymer, is meticulously designed to improve attachment to semiconductor wafers through an optimized adhesive layer, enhancing both functionality and safety during the manufacturing process.
Career Highlights
Tomomichi Takatsu has made significant contributions to notable companies throughout his career, including Denki Kagaku Kogyo Kabushiki Kaisha and Denka Company Limited. His experience at these organizations has allowed him to hone his skills in research and development, enabling him to specialize in innovative adhesive technologies.
Collaborations
In his journey, Takatsu has collaborated with accomplished colleagues such as Takeshi Saito and Masashi Kume. These partnerships have led to fruitful exchanges of ideas and innovative solutions, further driving advancements in their respective fields.
Conclusion
Tomomichi Takatsu’s impressive array of patents and his contributions to adhesive technology mark him as a key figure in the innovation landscape. His inventions not only address critical challenges in the semiconductor industry but also pave the way for future advancements in adhesive applications. With a solid foundation built on collaboration and a commitment to innovation, Takatsu continues to inspire the next generation of inventors.