The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
May. 31, 2010
Masashi Kume, Shibukawa, JP;
Tomomichi Takatsu, Shibukawa, JP;
Masashi Kume, Shibukawa, JP;
Tomomichi Takatsu, Shibukawa, JP;
DENKA COMPANY LIMITED, Tokyo, JP;
Abstract
After an adhesive sheet is pasted on a semiconductor wafer, an adhesive of the sheet increases tight attachment to the semiconductor wafer because wetting spreads over time. Due to this, at the time of peeling the adhesive sheet from the ground semiconductor wafer, the semiconductor wafer used to be damaged. This phenomenon is likely to occur for a thinner semiconductor wafer. The present invention resides in an adhesive sheet including a substrate and an adhesive layer disposed on the substrate. The substrate is formed of an ethylene/vinyl acetate copolymer having a vinyl acetate content of 10% by mass or less. The adhesive layer contains 100 parts by mass of a (meth)acrylate ester copolymer, 1 to 10 parts by mass of a cross-linker, 0.05 to 5 parts by mass of a silicone compound. The (meth)acrylate ester copolymer is formed of a copolymer produced by polymerizing a (meth)acrylate ester monomer and a functional-group-containing monomer.