The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Oct. 16, 2007
Applicants:
Takeshi Saito, Shibukawa, JP;
Tomomichi Takatsu, Shibukawa, JP;
Inventors:
Takeshi Saito, Shibukawa, JP;
Tomomichi Takatsu, Shibukawa, JP;
Assignee:
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multi-layered adhesive sheet, includes: a substrate film, an adhesive layerformed by coating an adhesive having a specific composition onto this substrate film, and a die attachment filmlaminated on the adhesive layer. The multi-layered adhesive sheetemploying an adhesive having this specific composition has superior retention of die chipduring the dicing of silicon wafer, allows the die attachment filmand adhesive layerto be easily peeled apart during a pick-up operation of the die chip, and prevents poor adhesion during the bonding of die chipto lead frame