The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8389629 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 05, 2013

Filed:

Oct. 16, 2007
Applicants:

Takeshi Saito, Shibukawa, JP;

Tomomichi Takatsu, Shibukawa, JP;

Inventors:

Takeshi Saito, Shibukawa, JP;

Tomomichi Takatsu, Shibukawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layered adhesive sheet, includes: a substrate film, an adhesive layerformed by coating an adhesive having a specific composition onto this substrate film, and a die attachment filmlaminated on the adhesive layer. The multi-layered adhesive sheetemploying an adhesive having this specific composition has superior retention of die chipduring the dicing of silicon wafer, allows the die attachment filmand adhesive layerto be easily peeled apart during a pick-up operation of the die chip, and prevents poor adhesion during the bonding of die chipto lead frame


Find Patent Forward Citations

Saito, Takeshi. (2013). Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part (U.S. Patent No. 8389629). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8389629

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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