This inventor holds 1 USPTO granted patent. Top assignee: Fei Comapny. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovations of Tomáš Onderlika
Tomáš Onderlika is a notable inventor based in Brno, Czech Republic. He has made significant contributions to the field of materials science through his innovative patent. His work focuses on improving methods for preparing wedged lamella, which has applications in various scientific and industrial processes.
Latest Patents
Tomáš Onderlika holds a patent for a "Method and system for preparing wedged lamella." This innovative method involves milling multiple sample slices from at least one side of a sample. The milling process is monitored using a scanning electron microscope (SEM) image acquired after removing one or more of the sample slices. The milling may be terminated when the estimated distance between a first structure and a second structure along the height of the milled sample is not greater than a specified threshold distance. This patent showcases his expertise in precision engineering and materials preparation.
Career Highlights
Tomáš Onderlika is currently employed at FEI Company, a leader in electron microscopy and focused ion beam technologies. His role at the company allows him to apply his innovative ideas and contribute to advancements in the field. His work has been instrumental in enhancing the capabilities of materials analysis and characterization.
Collaborations
Tomáš has collaborated with talented individuals such as Jakub Strejček and Jaroslav Stárek. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
In summary, Tomáš Onderlika is a distinguished inventor whose work in preparing wedged lamella has made a significant impact in materials science. His innovative approach and collaboration with skilled professionals continue to drive advancements in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
