The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
May. 13, 2022
Applicant:
Fei Company, Hillsboro, OR (US);
Inventors:
Jaroslav Stárek, Brno, CZ;
Tomáš Onderlika, Brno, CZ;
Lukáš Hübner, Brno, CZ;
Jakub Strejček, Brno, CZ;
Assignee:
FEI Company, Hillsboro, OR (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 1/28 (2006.01); G01N 23/2202 (2018.01); G01N 23/2251 (2018.01); H01J 37/20 (2006.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); G01N 23/2251 (2013.01); H01J 37/20 (2013.01); H01J 37/28 (2013.01); G01N 1/286 (2013.01); G01N 2001/2873 (2013.01); G01N 23/2202 (2013.01); G06T 2207/30108 (2013.01); H01J 37/222 (2013.01);
Abstract
Wedged lamella can be prepared by milling multiple sample slices from at least one side of a sample. The milling is monitored based on an SEM image acquired after removing one or more of the sample slices. The milling may be terminated responsive to an estimated distance between a first structure and a second structure along the height of the milled sample not greater than a threshold distance.