This inventor holds 4 USPTO granted patents. Top assignee: Intel Corporation. Active years: 1998-2002.
Company Filing History:
Years Active: 1998-2002
Title: The Innovations of Tom Mozdzen
Introduction
Tom Mozdzen is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of integrated circuit packaging. With a total of 4 patents to his name, Mozdzen's work has had a considerable impact on the technology industry.
Latest Patents
Among his latest patents is an innovative integrated circuit package. This package features a substrate that includes a first internal conductive bus and a second internal conductive bus, both located on a common layer of the substrate and dedicated to different power voltage levels. The busses are connected to external lands on the package's first surface through vias that extend through the substrate. The design allows for the integrated circuit to be mounted to a heat slug attached to the package's second surface. Additionally, some bond fingers are connected to the internal busses via conductive strips that wrap around the edges of the shelf. This design reduces the number of vias on the second surface, allowing for additional capacitors to be mounted.
Another patent by Mozdzen is also focused on an integrated circuit package that contains two in-plane voltage busses. This design shares similar features with his previous patent, emphasizing the importance of efficient design in integrated circuit packaging.
Career Highlights
Tom Mozdzen is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to develop and refine his patented technologies, contributing to the advancement of integrated circuits.
Collaborations
Throughout his career, Mozdzen has collaborated with talented individuals such as Koushik Banerjee and Robert J Chroneos, Jr. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Tom Mozdzen's contributions to integrated circuit packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and its applications in the industry. His work continues to influence the field and inspire future advancements.