The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 1998
Filed:
Sep. 09, 1996
Applicant:
Inventors:
Koushik Banerjee, Chandler, AZ (US);
Robert J Chroneos, Jr, Tempe, AZ (US);
Tom Mozdzen, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29832 ; 29830 ; 29840 ; 257712 ; 257713 ;
Abstract
A method for plating an integrated circuit package. The method includes constructing a package which has a plurality of internal bond fingers that are subsequently coupled to an integrated circuit. The package contains a plurality of vias that are electrically connected to the bond fingers. The vias are also coupled to a layer of metallization that extends across an outer surface of the package. The meallization layer is used as a plating bar to plate the internal bond fingers. After plating the meallization layer is etched from the surface of the package.