Bethlehem, PA, United States of America

Tom Grebs


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017-2018

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3 patents (USPTO):Explore Patents

Title: The Innovations of Tom Grebs

Introduction

Tom Grebs is an accomplished inventor based in Bethlehem, PA. He has made significant contributions to the field of semiconductor technology, holding three patents to his name. His work focuses on enhancing the efficiency and functionality of electronic devices.

Latest Patents

One of Tom's latest patents is a silicon package for embedded semiconductor chips and power converters. This innovative packaged transistor device includes a semiconductor chip featuring a transistor with terminals distributed on both the first and opposite second chip sides. The design incorporates a slab of low-grade silicon configured as a ridge, framing a depression that accommodates the chip. The ridge has a first surface in a first plane, while the recessed central area has a second surface spaced from the first plane by a depth at least equal to the chip thickness. The ridge is covered by device terminals connected to attachment pads in the central area, ensuring that the terminals of the opposite second chip side are co-planar with the device terminals on the slab ridge.

Career Highlights

Tom Grebs is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing semiconductor packaging solutions, which are crucial for modern electronic devices.

Collaborations

Throughout his career, Tom has collaborated with talented individuals such as Osvaldo Jorge Lopez and Jonathan Almeria Noquil. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Tom Grebs is a notable inventor whose work in semiconductor technology has led to significant advancements in the field. His innovative patents and collaborations highlight his commitment to improving electronic device efficiency and functionality.

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