Odawara, Japan

Tokiyuki Seto

This inventor holds 3 USPTO granted patents. Top assignee: Hitachi, Ltd.. Active years: 1989-1995.


% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 49(Granted Patents)


Company Filing History:


Years Active: 1989-1995

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3 patents (USPTO):Explore Patents

Title: The Innovations of Tokiyuki Seto

Introduction

Tokiyuki Seto is a notable inventor based in Odawara, Japan. He has made significant contributions to the field of ultrasonic bonding technology. With a total of 3 patents to his name, Seto continues to push the boundaries of innovation in his industry.

Latest Patents

Seto's latest patents include an ultrasonic bonding apparatus and a quality monitoring method. This apparatus features an ultrasonic wave controller, a bonding system with a bonding head, a laser oscillator, laser optics, and a vibration monitoring system that includes a vibrometer. Additionally, it has a mechanism for feeding back the monitoring results to the bonding condition. Another patent focuses on a bonding apparatus and testing apparatus for a bonded portion. This invention comprises a bonding tool, means for driving the bonding tool, and means for detecting the amount of crushing of a bonding portion during bonding. It also includes means for calculating the rate of change of the detected crushing amount, setting a target value from an external source, and controlling the driving means based on the comparison of detected values.

Career Highlights

Tokiyuki Seto is currently employed at Hitachi, Ltd., where he applies his expertise in ultrasonic bonding technology. His work has been instrumental in advancing the capabilities of bonding apparatuses, ensuring higher quality and efficiency in manufacturing processes.

Collaborations

Seto has collaborated with notable coworkers such as Ryoichi Kajiwara and Kazuya Takahashi. Their combined efforts have contributed to the development of innovative solutions in the field of bonding technology.

Conclusion

Tokiyuki Seto's contributions to ultrasonic bonding technology exemplify the spirit of innovation. His patents reflect a commitment to enhancing manufacturing processes and ensuring quality in production. Seto's work continues to inspire advancements in the industry.

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