Hitachi, Ltd.

Tokiyuki Seto

Kazuya Takahashi

Ryoichi Kajiwara

Kunihiro Tsubosaki

Kazuhiro Momata

Mituo Katou

Yoshinori Dekura

Mituo Kato

Setuo Sekine

Minoru Maruta

An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.

Ultrasonic bonding apparatus and quality monitoring method

A bonding apparatus comprising a bonding tool, means for driving the bonding tool, means for detecting an amount of crushing of a bonding portion during bonding, means for calculating a rate of change of the amount of crushing detected by the amount-of-crushing detecting means, means for setting a target value, which is inputted from an external source, of the amount of crushing of the bonding portion, and means for controlling the driving means. When the rate of change of the amount of crushing calculated by the calculating means is smaller than a predetermined value, the controlling means compares the amount of crushing detected by the amount-of-crushing detecting means with the target value. When the amount of crushing detected by the amount-of-crushing detecting means is smaller than the target value, the controlling means discriminates that the bonding is being performed in a satisfactory manner and hence should be continued.

Bonding apparatus and testing apparatus of a bonded portion

Conductor film terminals of a thin film magnetic head are composed of an Au film while lead terminals of a flexible printed circuit board are covered with an Au layer, so that both of these terminals can be bonded by low temperature ultrasonic bonding directly between Au and Au. The reverse surface of the lead terminals of the flexible printed circuit board is bonded and fixed to a flexible polymer resin cover film so that the dimensional accuracy of the bonded terminal portion can be improved.

Thin film magnetic head having Au ultrasonic connection structure

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Odawara, Japan

Tokiyuki Seto