The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 1995
Filed:
Jan. 22, 1993
Applicant:
Inventors:
Ryoichi Kajiwara, Hitachi, JP;
Mituo Katou, Hitachiota, JP;
Kazuya Takahashi, Katsuta, JP;
Minoru Maruta, Minamiashigara, JP;
Tokiyuki Seto, Odawara, JP;
Kunihiro Tsubosaki, Hino, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228102 ; 228103 ; 2281101 ; 228-11 ;
Abstract
An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.
Quick Actions:
Kajiwara, Ryoichi. (1995). Ultrasonic bonding apparatus and quality monitoring method (U.S. Patent No. 5431324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5431324
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile