Saarbruecken, Germany

Tobias Kraus

USPTO Granted Patents = 4 

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Zurich, CH (2010)
  • Saarbruecken, DE (2009 - 2013)

Company Filing History:


Years Active: 2009-2013

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4 patents (USPTO):Explore Patents

Title: The Innovations of Tobias Kraus

Introduction

Tobias Kraus is a notable inventor based in Saarbruecken, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced methods for fabricating electrode arrays and three-dimensional structures.

Latest Patents

Kraus's latest patents include innovative techniques for creating electrode arrays. One of his patents describes methods of fabricating electrode arrays using printing plates to arrange conductive particles in alignment with an array of electrodes. This invention involves a semiconductor device that comprises a semiconductor topography with an array of electrodes on a substrate, a dielectric layer, and conductive particles aligned with the electrodes.

Another significant patent by Kraus details methods for fabricating three-dimensional structures. This process involves using a printing plate to arrange particles at predefined positions, allowing for the transfer of layers of particles to a substrate. The method emphasizes precision in aligning the particles to create complex structures.

Career Highlights

Tobias Kraus is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices.

Collaborations

Kraus has collaborated with notable colleagues, including Heiko Wolf and Ute Drechsler. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Tobias Kraus is a prominent figure in the realm of semiconductor innovation, with a focus on electrode arrays and three-dimensional structures. His contributions through his patents and collaborations continue to shape the future of technology.

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