International Business Machines Corporation

Tobias Kraus

Heiko Wolf

James L Hedrick

Robert Dennis Miller

Urs T Duerig

Bernd W Gotsmann

Armin W Knoll

Jane Elizabeth Frommer

Ute Drechsler

Laurent Malaquin

Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array

Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.

Three-dimensional structures and methods of fabricating the same using a printing plate

A method of protecting a polymeric layer from contamination by a photoresist layer. The method includes: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, thereby exposing regions of the protection layer; (e) etching through the protection layer and the polymeric layer where the protection layer is not protected by the patterned photoresist layer; (f) removing the patterned photoresist layer in a first removal process; and (g) removing the protection layer in a second removal process different from the first removal process.

Protection of polymer surfaces during micro-fabrication

A method of transferring nanoparticles to a surface is provided. The method includes rotating a perimeter surface through a colloidal solution such that nanoparticles are captured by binding sites, removing liquid from the captured nanoparticles and rotating a take-up roll such that the captured nanoparticles contact a carrier surface. Moreover, the method includes removing the captured nanoparticles from the perimeter surface and transferring the nanoparticles to the carrier surface with a carrier adhesive material, rotating the carrier surface such that the transferred nanoparticles contact a target substrate, and removing the transferred nanoparticles from the carrier surface and transferring the transferred nanoparticles to the target substrate with a target substrate material.

Growing community of inventors

Saarbruecken, Germany

Tobias Kraus