Singapore, Singapore

Ting Yu He


Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014-2015

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3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Ting Yu He

Introduction

Ting Yu He is a notable inventor based in Singapore, recognized for his contributions to the field of technology. He has been granted 3 patents for his innovative designs and solutions. His work primarily focuses on advancements in wire bonding machines, which are essential in the semiconductor industry.

Latest Patents

One of Ting Yu He's latest patents includes a lead frame support plate and a window clamp for wire bonding machines. This invention features a lead frame support plate that incorporates a network of suction grooves on its support surface. Each suction groove is designed to be in fluid communication with at least one vacuum hole, allowing a suction force to be generated. This mechanism effectively holds a lead frame against the support surface. Additionally, the window clamp is designed with slots to compensate for any deformation, enhancing the overall functionality of the wire bonding machines.

Career Highlights

Ting Yu He is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate and develop new technologies. His work has significantly impacted the efficiency and effectiveness of wire bonding processes in the semiconductor industry.

Collaborations

Ting Yu He collaborates with talented individuals such as Phui Phoong Chuang and Hasrul Bin Hasim, contributing to a dynamic and innovative work environment.

Conclusion

Ting Yu He exemplifies the spirit of innovation through his patents and contributions to technology. His work in wire bonding machines showcases his commitment to advancing the field and improving manufacturing processes.

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