The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Jul. 24, 2009
Keng Yew James Song, Singapore, SG;
Ka Shing Kenny Kwan, Singapore, SG;
Choong Kead Leslie Lum, Singapore, SG;
Ting Yu He, Singapore, SG;
Keng Yew James Song, Singapore, SG;
Ka Shing Kenny Kwan, Singapore, SG;
Choong Kead Leslie Lum, Singapore, SG;
Ting Yu He, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.