Singapore, Singapore

Keng Yew James Song

USPTO Granted Patents = 5 

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 2009-2014

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5 patents (USPTO):Explore Patents

Title: Innovations by Keng Yew James Song

Introduction

Keng Yew James Song is a notable inventor based in Singapore, SG. He has made significant contributions to the field of electronic device bonding, holding a total of 5 patents. His work focuses on enhancing the efficiency and effectiveness of bonding processes in electronic manufacturing.

Latest Patents

One of his latest patents is a bonding machine incorporating a dual-track transfer mechanism. This innovative bonding apparatus is designed for bonding electronic devices, including substrates. It features first and second rails arranged adjacent to each other, which align the substrates in vertical orientations during transportation. The bonding system is strategically locatable over two bonding sites along the rails, allowing for simultaneous operations. Additionally, a container at one end of the rails holds multiple unbonded substrates, feeding them directly to the rails for processing.

Another significant patent by Keng Yew James Song is an automatic wire feeding method for wire bonders. In this invention, wire is fed to a bonding tool of a wire bonder using a pneumatic device. This device urges the wire to feed through an outlet towards the bonding tool. A wire clamp and a wire guider are positioned to ensure the wire is threaded correctly before reaching the bonding tool, enhancing the precision of the bonding process.

Career Highlights

Keng Yew James Song is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate in the field of electronic bonding technologies. His expertise and inventions have significantly impacted the efficiency of manufacturing processes in the electronics industry.

Collaborations

He collaborates with talented coworkers, including Ka Shing Kenny Kwan and Yam Mo Wong, who contribute to the innovative environment at Asm Technology Singapore Pte Ltd.

Conclusion

Keng Yew James Song's contributions to the field of electronic device bonding through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the industry positively, paving the way for advancements in electronic manufacturing.

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