Asm Technology Singapore Pte Ltd

Ting Yu He

Ka Shing Kwan

Phui Phoong Chuang

Siti Nurulhaida Bt Ramlan

Wan Azmi

Hasrul Bin Hasim

Jun Wan

Ka Shing Kenny Kwan

Keng Yew James Song

Choong Kead Leslie Lum

A lead frame support plateand a window clampfor wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plateincludes a network of suction groovesprovided on a support surface, each suction groovebeing arranged to be in fluid communication with at least a vacuum holeto enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamphaving slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

Lead frame support plate and window clamp for wire bonding machines

A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

Bonding machine incorporating dual-track transfer mechanism

Growing community of inventors

Singapore, Singapore

Ting Yu He