This inventor holds 1 USPTO granted patent. Top assignee: Via Alliance Semiconductor Co., Ltd.. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Ting-You Wei: Innovator in Circuit Substrate Technology
Introduction
Ting-You Wei is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of circuit substrate technology. His innovative work has led to the development of a unique patent that enhances the functionality and efficiency of electronic devices.
Latest Patents
Ting-You Wei holds a patent for a circuit substrate and package structure. This invention provides a circuit substrate that includes a molding compound with a chip-side surface and a solder ball-side surface. A first conductive bulk is embedded in the molding compound, featuring a specific arrangement of bond pad surfaces. The design ensures that the width of the first conductive bulk exceeds the widths of the bond pad surfaces, optimizing the overall structure for better performance.
Career Highlights
Ting-You Wei is currently associated with Via Alliance Semiconductor Co., Ltd. His work at the company has been instrumental in advancing semiconductor technologies. His expertise in circuit substrates has positioned him as a key player in the industry.
Collaborations
Ting-You Wei has collaborated with talented individuals such as Chen-Yueh Kung and Hsin-I Chuang. These partnerships have fostered innovation and contributed to the success of their projects.
Conclusion
Ting-You Wei's contributions to circuit substrate technology exemplify his dedication to innovation. His patent and work at Via Alliance Semiconductor Co., Ltd. highlight his role as a leading inventor in the field.