This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Ting Ting Au: Innovator in Integrated Circuit Technology
Introduction
Ting Ting Au is a notable inventor based in Bayan Lepas, Malaysia. She has made significant contributions to the field of integrated circuit technology. Her innovative work has led to the development of a unique patent that enhances circuit design flexibility.
Latest Patents
Ting Ting Au holds a patent for an "On-die termination (ODT) circuit configurable with via layer to support multiple standards." This integrated circuit device features a single via layer that includes selectable via sites and/or jumpers. The design allows for the configuration and interconnection of components and circuitry between distinct layers of multilayer circuits. By selectively enabling via sites through filling via openings and/or using jumpers, the circuit can implement various termination configurations, including a single-ended termination circuit, a Thevenin termination circuit, and a differential termination circuit.
Career Highlights
Ting Ting Au is currently employed at Intel Corporation, where she continues to push the boundaries of integrated circuit technology. Her work is instrumental in advancing the capabilities of electronic devices.
Collaborations
Ting Ting collaborates with Eah Loon Alan Chuah, who is also a talented professional in the field. Their partnership contributes to the innovative projects at Intel Corporation.
Conclusion
Ting Ting Au's contributions to integrated circuit technology exemplify her dedication to innovation. Her patent reflects her expertise and commitment to advancing electronic design.