Timothy William Bray

Vancouver, Canada

Timothy William Bray

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 112(Granted Patents)


Company Filing History:


Years Active: 2005-2024

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15 patents (USPTO):

Title: Innovator Spotlight: Timothy William Bray

Introduction:

Timothy William Bray, an innovative inventor based in Vancouver, Canada, has an impressive portfolio of 12 patents to his name. His groundbreaking work in the field of semiconductor technology has garnered recognition and praise within the industry.

Latest Patents:

Among his latest patents is the "Buried contact layer for UV emitting device." This patent describes a revolutionary light emitting structure that includes a layered semiconductor stack with specific attributes to enhance performance. The incorporation of superlattices and optimized electrical conductivities demonstrates Bray's commitment to pushing the boundaries of technological advancement.

Career Highlights:

Timothy Bray has contributed his expertise to renowned companies such as Amazon Technologies, Inc. and Silanna UV Technologies Pte Ltd. His tenure at these organizations has been marked by a dedication to innovation and a relentless pursuit of excellence in semiconductor research and development.

Collaborations:

Throughout his career, Bray has collaborated with esteemed colleagues such as Johnny Cai Tang and Chun To Lee. Together, they have worked on cutting-edge projects that have led to groundbreaking advancements in the semiconductor industry. Their combined efforts have set new standards for efficiency and effectiveness in technology development.

Conclusion:

Timothy William Bray continues to be a driving force in the world of inventions and innovations, with a passion for creating solutions that have a tangible impact on society. His relentless pursuit of excellence and collaborative spirit make him a standout figure in the field of semiconductor technology, setting the stage for even more groundbreaking developments in the future.

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