This inventor holds 1 USPTO granted patent. Top assignee: Electro Scientific Industries, Inc.. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Tim Webb - Innovator in Substrate Technology
Introduction
Tim Webb is a notable inventor based in Portland, Oregon. He has made significant contributions to the field of substrate technology, particularly through his innovative methods of forming apertures within substrates. His work has implications for various applications in electronics and materials science.
Latest Patents
Tim Webb holds a patent for a substrate containing an aperture and methods of forming the same. This patent describes a method of forming an aperture, such as a through via or a blind via, within a substrate. The process involves irradiating the substrate with a laser beam to create a laser-machined feature with a specific sidewall. This feature can then be processed to alter characteristics like surface roughness and diameter. The final step includes an isotropic wet-etch process using an etchant solution that contains HNO, HF, and optionally acetic acid. Tim holds 1 patent.
Career Highlights
Tim Webb is currently employed at Electro Scientific Industries, Inc., where he continues to develop innovative technologies. His work has been instrumental in advancing the capabilities of substrate manufacturing and processing.
Collaborations
Some of Tim's coworkers include Andy E. Hooper and Daragh Finn, who contribute to the collaborative environment at Electro Scientific Industries, Inc. Their combined expertise fosters innovation and drives the development of new technologies.
Conclusion
Tim Webb's contributions to substrate technology through his patented methods highlight his role as an influential inventor in the field. His work continues to impact the industry positively.