Electro Scientific Industries, Inc.

Tim Webb

Daragh Finn

Lynn Sheehan

Andy E Hooper

Yu Chong Tai

Kenneth Pettigrew

A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO, HF and, optionally acetic acid.

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Portland, OR, United States of America

Tim Webb