The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Oct. 06, 2011
Applicants:

Andy Hooper, Portland, OR (US);

Daragh Finn, Portland, OR (US);

Tim Webb, Portland, OR (US);

Lynn Sheehan, Vancouver, WA (US);

Kenneth Pettigrew, Portland, OR (US);

Yu Chong Tai, Pasadena, CA (US);

Inventors:

Andy Hooper, Portland, OR (US);

Daragh Finn, Portland, OR (US);

Tim Webb, Portland, OR (US);

Lynn Sheehan, Vancouver, WA (US);

Kenneth Pettigrew, Portland, OR (US);

Yu Chong Tai, Pasadena, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); B23K 26/00 (2014.01); B44C 1/22 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); B23K 26/36 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B23K 26/00 (2013.01); B44C 1/22 (2013.01); H01L 21/30604 (2013.01); H01L 21/3065 (2013.01); B23K 26/367 (2013.01); B23K 26/381 (2013.01); B23K 26/385 (2013.01); B23K 26/4075 (2013.01); B23K 26/407 (2013.01); B23K 26/408 (2013.01); B23K 26/4095 (2013.01); H01L 21/76898 (2013.01); Y10S 438/94 (2013.01);
Abstract

A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO, HF and, optionally acetic acid.


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