Portland, OR, United States of America

Kenneth Pettigrew

This inventor holds 1 USPTO granted patent. Top assignee: Electro Scientific Industries, Inc.. Active years: 2014.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Kenneth Pettigrew: Innovator in Substrate Technology

Introduction

Kenneth Pettigrew is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of substrate technology, particularly through his innovative methods of forming apertures within substrates. His work has implications for various applications in electronics and materials science.

Latest Patents

Kenneth Pettigrew holds a patent for a substrate containing an aperture and methods of forming the same. This patent describes a method of forming an aperture, such as a through via or a blind via, within a substrate by irradiating it with a laser beam. The process involves creating a laser-machined feature with specific characteristics, which can then be processed to form the desired aperture using an isotropic wet-etch process with a specialized etchant solution.

Career Highlights

Kenneth Pettigrew is currently employed at Electro Scientific Industries, Inc., where he continues to develop and refine his innovative techniques. His work has contributed to advancements in the manufacturing processes of electronic components, enhancing the efficiency and effectiveness of substrate applications.

Collaborations

Some of Kenneth's coworkers include Andy E Hooper and Daragh Finn, who collaborate with him on various projects within the company. Their combined expertise fosters a creative environment that drives innovation in substrate technology.

Conclusion

Kenneth Pettigrew's contributions to substrate technology through his patent and work at Electro Scientific Industries, Inc. highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of electronic manufacturing processes.

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