This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sandisk Technologies Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Tim Huang - Innovator in Semiconductor Technology
Introduction
Tim Huang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances performance and efficiency.
Latest Patents
Tim Huang holds a patent for a semiconductor device with optimized underfill flow. This patent describes a semiconductor device package that includes a semiconductor die with bond pads and an underfill inlet side. The device also features a substrate with a first metal layer and lower metal layers underneath it. Additionally, it incorporates a plurality of metal contacts and trace segment lines in the first metal layer, along with several solder bump rows. Each solder bump row is oriented parallel to the inlet side of the semiconductor die, establishing electrical connections between the bond pads and corresponding metal contacts. The trace segment lines are also oriented parallel to the inlet side and are electrically coupled to the solder bump rows, ensuring efficient functionality.
Career Highlights
Tim Huang is currently employed at Sandisk Technologies Inc., where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in advancing the technology used in modern electronic devices.
Collaborations
Tim has collaborated with talented coworkers such as Yihao Chen and Zengyu Zhou. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Tim Huang is a key figure in the semiconductor industry, with a focus on optimizing device performance through innovative designs. His contributions are paving the way for future advancements in technology.