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For the Inventor, By the Inventor

Suzhou, China

Tiburcio A Maldo

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 35(Granted Patents)


Location History:

  • Jiangsu, CN (2010 - 2011)
  • Suzhou, CN (2009 - 2013)

Company Filing History:

goldMedal12 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents

Years Active: 2009-2013

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12 patents (USPTO):Explore Patents
1. 8508025 - Folded leadframe multiple die package (2013-08-13),
2. 8426953 - Semiconductor package with an embedded printed circuit board and stacked die (2013-04-23),
3. 8198710 - Folded leadframe multiple die package (2012-06-12),
4. 8088645 - 3D smart power module (2012-01-03),
5. 8030743 - Semiconductor package with an embedded printed circuit board and stacked die (2011-10-04),
6. 7952204 - Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same (2011-05-31),
7. 7902646 - Multiphase synchronous buck converter (2011-03-08),
8. 7821114 - Multiphase synchronous buck converter (2010-10-26),
9. 7808101 - 3D smart power module (2010-10-05),
10. 7696612 - Multiphase synchronous buck converter (2010-04-13),
11. 7586179 - Wireless semiconductor package for efficient heat dissipation (2009-09-08),
12. 7564124 - Semiconductor die package including stacked dice and heat sink structures (2009-07-21),

Title: Tiburcio A Maldo: Innovator in Semiconductor Technology

Introduction

Tiburcio A Maldo is a prominent inventor based in Suzhou, China. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His innovative designs have advanced the capabilities of electronic devices, particularly in power management and packaging.

Latest Patents

Among his latest patents is the "Folded leadframe multiple die package." This invention features a folded leadframe that interconnects at least two die attached to another leadframe. In a synchronous voltage regulator, this folded leadframe, formed from a single piece of material, connects the high side switching device with the low side switching device. This design provides a low resistance, low inductance connection between the two devices. Another notable patent is the "Semiconductor package with an embedded printed circuit board and stacked die." This two-tier power module includes a PC board with upper and lower traces, containing a power device with upward extending solder bump connections. The assembly is designed to encapsulate the components while leaving exposed the bottom surfaces of the lower traces as external connections.

Career Highlights

Tiburcio A Maldo is currently employed at Fairchild Semiconductor Corporation, where he continues to innovate in semiconductor packaging and power management solutions. His work has been instrumental in enhancing the performance and efficiency of electronic devices.

Collaborations

He has collaborated with notable coworkers such as Yong Liu and Hua Yang, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Tiburcio A Maldo's contributions to the field of semiconductor technology through his patents and innovative designs have made a significant impact on the industry. His work continues to inspire advancements in electronic device performance and efficiency.

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