The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Oct. 09, 2007
Applicants:
Paul Armand Calo, Lapu-Lapu, PH;
Margie T. Rios, Mandaue, PH;
Tiburcio A. Maldo, Suzhou, CN;
Joonseo Son, Mapo Gu, KR;
Erwin Ian V. Almagro, Dumaguete, PH;
Inventors:
Paul Armand Calo, Lapu-Lapu, PH;
Margie T. Rios, Mandaue, PH;
Tiburcio A. Maldo, Suzhou, CN;
JoonSeo Son, Mapo Gu, KR;
Erwin Ian V. Almagro, Dumaguete, PH;
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.