The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2010

Filed:

Feb. 08, 2008
Applicants:

Yong Liu, Scarborough, ME (US);

Yumin Liu, Jiangsu, CN;

Hua Yang, Jiang Sue Province, CN;

Tiburcio A. Maldo, Jiangsu, CN;

Margie T. Rios, Mandaue, PH;

Inventors:

Yong Liu, Scarborough, ME (US);

Yumin Liu, Jiangsu, CN;

Hua Yang, Jiang Sue Province, CN;

Tiburcio A. Maldo, Jiangsu, CN;

Margie T. Rios, Mandaue, PH;

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.


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