Suzhou, China

Hua Yang


Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Jiang Sue Province, CN (2010)
  • Jiangsu, CN (2010)
  • Jiangsu Province, CN (2011)
  • Suzhou, CN (2010 - 2013)

Company Filing History:


Years Active: 2010-2013

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10 patents (USPTO):Explore Patents

Title: Innovations of Inventor Hua Yang

Introduction

Hua Yang is a prominent inventor based in Suzhou, China. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on innovative packaging solutions that enhance the performance and efficiency of electronic devices.

Latest Patents

One of Hua Yang's latest patents is the "Folded leadframe multiple die package." This invention includes a folded leadframe for interconnecting at least two die attached to another leadframe. In a synchronous voltage regulator, the folded leadframe, formed from a single piece of material, connects the high side switching device with the low side switching device to provide a low resistance, low inductance connection between the two devices. Another notable patent is the "Semiconductor package with an embedded printed circuit board and stacked die." This two-tier power module features a PC board with upper and lower traces, containing a power device with upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board, with vias connecting selected upper and lower traces.

Career Highlights

Hua Yang is currently employed at Fairchild Semiconductor Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced packaging technologies that improve the performance of electronic components.

Collaborations

Hua has collaborated with several talented individuals in his field, including Yong Liu and Tiburcio A Maldo. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hua Yang's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the future of electronic device packaging.

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