This inventor holds 1 USPTO granted patent. Top assignee: Versum Materials US, LLC. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Tianniu Rick Chen: Innovator in High Aspect Ratio Structures
Introduction
Tianniu Rick Chen is a notable inventor based in Chupei, Taiwan. He has made significant contributions to the field of materials science, particularly in the area of preventing the collapse of high aspect ratio structures during drying processes. His innovative work has implications for various applications in technology and manufacturing.
Latest Patents
Tianniu Rick Chen holds a patent titled "Compositions and methods for preventing collapse of high aspect ratio structures during drying." This patent describes an aqueous composition designed to treat substrates with patterns having line-space dimensions of 50 nm or below. The composition includes a solvent system comprising water and a water-miscible organic solvent, a surface modifier that is a reaction product between an alkylamine and an organic acid, and an optional pH adjusting agent. This invention addresses critical challenges in maintaining the integrity of micro-patterns during drying.
Career Highlights
Tianniu Rick Chen is currently employed at Versum Materials US, LLC, where he continues to advance his research and development efforts. His work at the company focuses on innovative solutions that enhance material performance and reliability in various applications.
Collaborations
Tianniu has collaborated with esteemed colleagues such as Jhih Kuei Ge and Yi-Chia Lee. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise in the field of materials science.
Conclusion
Tianniu Rick Chen is a prominent inventor whose work in preventing the collapse of high aspect ratio structures has made a significant impact in the field. His innovative approaches and collaborations continue to drive advancements in materials science.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
