This inventor holds 2 USPTO granted patents. Top assignee: Seagate Technology Incorporated. Active years: 2001-2005.
Company Filing History:
Years Active: 2001-2005
Title: Innovations by Tiang Fee Yin
Introduction
Tiang Fee Yin is a notable inventor based in Singapore, recognized for his contributions to the field of technology. He holds 2 patents that showcase his innovative approach to electronic components and circuit board assemblies. His work has significantly impacted the efficiency and functionality of modern electronic devices.
Latest Patents
Tiang Fee Yin's latest patents include a "Surface mount IC stacking method and device" and a "Double-sided single-print straddle mount assembly." The surface mount IC stacking method involves packaged surface mount (SMT) chips that have matched top and bottom contacts, allowing for easier manufacturing and improved connectivity between chip layers. This invention also includes options for additional spacing and routing layers, as well as configurations for different conductor and nonvolatile cell setups. The double-sided single-print straddle mount assembly enhances printed circuit board (PCB) assemblies by allowing connectors to be straddle mounted to the edge of the PCB. This design optimizes solder deposition and bond formation, resulting in a more robust assembly.
Career Highlights
Tiang Fee Yin is currently employed at Seagate Technology Incorporated, where he continues to innovate and develop new technologies. His work at Seagate has positioned him as a key player in the advancement of electronic components.
Collaborations
Throughout his career, Tiang has collaborated with notable coworkers such as Chau Chin Low and Oscar Woo. These partnerships have contributed to the successful development of his patents and innovations.
Conclusion
Tiang Fee Yin's contributions to technology through his patents reflect his dedication to innovation in the field of electronics. His work continues to influence the design and functionality of modern electronic devices.