The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
Aug. 25, 2000
Arman Mohtar, Singapore, SG;
Tiang Fee Yin, Singapore, SG;
Seagate Technology LLC, Scotts Valley, CA (US);
Abstract
The present invention provides for an improved printed circuit board assembly. The connector is straddle mounted to an edge of a printed circuit board with first connector leads configured for abutment with a primary surface of the printed circuit board (PCB) and second connector leads configured for abutment with a secondary surface of the PCB. Holes are provided in the PCB between the first connector leads. The second connector leads are arranged to abut the PCB directly where the holes open on the secondary surface. Solder is deposited on only the primary surface of the PCB directly on the locations where bond formation is desired between the first connector leads and the PCB, that is, on first contact pads. Solder is deposited in the same process on the primary surface, directly above the locations where bond formation is desired between the second connector leads and the PCB, that is, directly above the second contact pads on the other surface of the PCB. The holes are preferably plated through holes, in which case solder bonds may also be formed formed between the connector leads and the walls of the holes, thereby providing strengthened bond formation.