Tian See Hoe

Title: The Innovations of Tian See Hoe

Introduction

Tian See Hoe is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a patented semiconductor module that enhances performance and safety.

Latest Patents

Tian See Hoe holds a patent for a "Molded semiconductor module having a mold step for increasing creepage distance." This invention includes a dual-gauge leadframe with thicker and thinner parts, where part of the thinner section forms a high voltage lead. The semiconductor die is attached to the thicker part, and a molding compound encapsulates the die. The design features a stepped region that increases the creepage distance, ensuring better safety and efficiency in high voltage applications. This patent is a testament to his expertise and innovative thinking in semiconductor design. He has 1 patent to his name.

Career Highlights

Tian See Hoe is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role involves working on advanced technologies that push the boundaries of what is possible in the semiconductor industry. His contributions have been instrumental in developing products that meet the growing demands of modern electronics.

Collaborations

Throughout his career, Tian has collaborated with talented professionals, including Oliver Markus Kreiter and Ludwig Busch. These collaborations have fostered an environment of innovation and creativity, leading to groundbreaking advancements in semiconductor technology.

Conclusion

Tian See Hoe's work exemplifies the spirit of innovation in the semiconductor industry. His patented inventions and collaborations highlight his commitment to advancing technology and improving product safety. His contributions will undoubtedly have a lasting impact on the field.