Infineon Technologies Ag

Tian See Hoe

Ivan Nikitin

Thomas Stoek

Sanjay Kumar Murugan

Ke Yan Tean

Michael Niendorf

Mei Fen Hiew

Oliver Markus Kreiter

Elvis Keli

Angel Enverga

Kean Ming Koe

Ludwig Busch

Bernhard Stiller

A semiconductor module includes: a dual-gauge leadframe having thicker and thinner parts, part of the thinner part forming a high voltage lead; a semiconductor die attached to the thicker part; and a molding compound (MC) encapsulating the die. The thicker leadframe part is disposed at a bottom side of the MC. A side face of the MC has a stepped region between the high voltage lead and thicker leadframe part. A first generally vertical part of the stepped region extends from the high voltage lead to the generally horizontal part, a generally horizontal part of the stepped region extends to the second generally vertical part, and a second generally vertical part of the stepped region extends to the bottom side of the MC. A linear dimension of the generally horizontal part as measured from the first generally vertical part to the second generally vertical part is at least 4.5 mm.

Molded semiconductor module having a mold step for increasing creepage distance

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Melaka, Malaysia

Tian See Hoe